TSMC
7 posts
Apple A20: first 2nm Apple Silicon, DRAM moves off-stack for thermals, 96-bit LPDDR6
Leaks show Apple's A20 will be the first 2nm Apple Silicon, repackaging DRAM to the side of the SoC (WMCM) for thermals, and jumping to 96-bit LPDDR6.
Apple Silicon's first generation skip: M6 ships base-only, M6 Pro/Max cut to make room for M7
Bloomberg reports Apple will skip M6 Pro and M6 Max entirely, pushing pro-tier Mac chips to the M7 family in late 2027 — the first break in Apple Silicon's annual Pro/Max cadence since 2020.
Samsung's $648B Korean AI bet — SK Hynix joins, 2040s expansion pulled into mid-2030s
Samsung will announce a ₩1,000T (~$648B) ten-year plan, with SK Hynix joining. Korean chip expansion planned for the 2040s is being pulled into the mid-2030s by AI memory demand.
IBM ships first sub-1nm chip: 0.7nm (7Å) at Albany, ~100B transistors on a nail-sized die
IBM unveils a 0.7nm (7-angstrom) chip — humanity's first sub-1nm node. Density 2× its own 2nm, ~100B transistors on a nail-sized die. Mass production in ~5 years.
Trump announces Apple–Intel US foundry deal — ends Apple's decade of TSMC exclusivity
Trump confirms an Apple–Intel US foundry deal on Truth Social. Intel stock jumped 9% pre-market. Apple's decade-long TSMC exclusivity gets its first crack.
Anthropic in talks with Microsoft for Maia chips — pays SpaceX $1.5B monthly
Anthropic faces severe compute shortage. Q1 demand grew 80× annualized; plans accounted for 10×. Now in talks to rent Microsoft Maia servers, while paying SpaceX $1.25B/month for compute.
AMD pours $10B+ into Taiwan — Helios AI servers ship H2 2026
AMD commits over $10B to Taiwan's semiconductor ecosystem on May 21 — partnerships with ASE and SPIL for advanced packaging, and Helios rack-scale AI platform shipping H2 2026.